BAT54TW /ADW /
BAT54TW /ADW /CDW /SDW /BRW
Document number: DS30152 Rev. 16 - 2
1 of 3
www.diodes.com
July 2008
? Diodes Incorporated
CDW /SDW /BRW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Features
?
Low Forward Voltage Drop
?
Fast Switching
?
Ultra-Small Surface Mount Package
?
PN Junction Guard Ring for Transient and ESD Protection
?
Lead Free/RoHS Compliant (Note 2)
?
"Green" Device (Note 3 and 4)
Mechanical Data
?
Case: SOT-363
?
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Terminals: Solderable per MIL-STD-202, Method 208
?
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
?
Orientation: See Diagrams Below
?
Marking Information: See Page 3
?
Ordering Information: See Page 2
?
Weight: 0.006 grams (approximate)
A1
A2
C2
C1
C2
C1
C1
C2
A2
A
1
A2
A1
AC
1
AC
2
C2
A
1
A2
C1
AC
1
AC
2
C1
A
1
C2
A
2
C1
A3
C2
A
1
C3
A2
Top View
BAT54ADW* BAT54CDW* BAT54SDW*
BAT54BRW
BAT54TW
*Symmetrical configuration, no orientation indicator.
Maximum Ratings
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30
V
Forward Continuous Current (Note 1)
IF
200
mA
Repetitive Peak Forward Current (Note 1)
IFRM
300
mA
Forward Surge Current (Note 1) @ t < 1.0s
IFSM
600
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
200
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
RθJA
625
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +125
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 5)
V(BR)R
30
?
?
V
IR
= 100
μA
Forward Voltage (Note 5)
VF
?
?
240
320
400
500
1000
mV
IF
= 0.1mA
IF
= 1mA
IF
= 10mA
IF
= 30mA
IF
= 100mA
Reverse Leakage Current (Note 5)
IR
?
?
2.0
μA
VR
= 25V
Total Capacitance
CT
?
?
10
pF
VR
= 1.0V, f = 1.0MHz
Reverse Recovery Time
trr
?
?
5.0
ns
IF
= 10mA through I
R
= 10mA
to IR
= 1.0mA, R
L
= 100
Ω
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
5. Short duration pulse test used to minimize self-heating effect.
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